Home Products OLED Module Graphic OLED Display WEO012864D-ZIF

Small OLED Display, Smallest OLED 128x64, 0.96" (Thin) - ZIF FPC

Model No. WEO012864D-ZIF

►Small OLED Display, Smallest OLED
►Suitable for wearable device
►Type: Graphic (Without Frame)
►Structure: COG + ZIF FPC
►128 x 64 Dot Matrix
►Built-in controller SSD1306BZ
►3V Power supply
►1/64 duty
►Interface: 6800, 8080, SPI, I2C

DESCRIPTION

WEO012864D-ZIF Thinner version 0.96" OLED without Sponge

WEO012864D-ZIF model is a thinner version of small OLED display WEO012864D with ZIF FPC on module which is made of 128x64 pixels, diagonal size 0.96 inch. The thinner version smallest OLED WEO012864D-ZIF model is built-in with SSD1306BZ driver IC; it communicates via 6800/8080 8-bit parallel and I2C/SPI interface.

Adopting thinner OLED panel is a new trend, for new projects, we recommend customers to choose the thinner WEO012864D for new design projects. WEO012864D-ZIF module can be operating at temperatures from -40℃ to +80℃; its storage temperatures range from -40℃ to +85℃. 

  • P/N for white: WEO012864DWPP3N00F00
  • P/N for blue: WEO012864DBPP3N00F00 (might have MOQ)
  • Datasheet Download

 

WEO012864D-ZIF Thinner version 0.96" OLED with Sponge

If customers would like to adopt this WEO012864D-ZIF thinner version to replace the existing one, you can choose the below part numbers which we add sponge at the back of the module to make them compatible to the existing ones for your applications. Please note, white emitting color is having the advantage of shorter lead-time. We recommend customer to choose white color as your priority choice.

  • P/N for white with sponge: WEO012864DWPP3N00F01
  • P/N for blue with sponge: WEO012864DBPP3N00F01 (might have MOQ)
  • Datasheet Download

DRAWING

Small OLED Display manufacturers, Smallest OLED - WEO012864D-ZIF (Thinner version without sponge)
0.96" OLED, Thin OLED Display - WEO012864D-Hotbar (Thinner Version with Sponge)

SPECIFICATIONS

Interface Pin Function

No. Symbol Function
1 N.C. (GND) Reserved Pin (Supporting Pin)
The supporting pins can reduce the influences from stresses on the function pins. These pins must be connected to external ground.
2 C2N Positive Terminal of the Flying Inverting CapacitorNegative Terminal of the Flying Boost CapacitorThe charge-pump capacitors are required between the terminals. They must be floated when the converter is not used.
3 C2P
4 C1P
5 C1N
6 VBAT Power Supply for DC/DC Converter Circuit
This is the power supply pin for the internal buffer of the DC/DC voltage converter. It must be connected to external source when the converter is used. It should be connected to VDD when the converter is not used.
7 NC NC
8 VSS Ground of Logic Circuit
This is a ground pin. It acts as a reference for the logic pins. It must be connected to external ground.
9 VDD Power Supply for Logic
This is a voltage supply pin. It must be connected to external source.
10 BS0 Communicating Protocol Select
These pins are MCU interface selection input. See the
following table:
  BS0 BS1 BS2
I2C 0 1 0
3-wire SPI 1 0 0
4-wire SPI 0 0 0
8-bit 68XX Parallel 0 0 1
8-bit 80XX Parallel 0 1 1
11 BS1
12 BS2
13 CS# Chip Select
This pin is the chip select input. The chip is enabled for MCU communication only when CS# is pulled low.
14 RES# Power Reset for Controller and Driver
This pin is reset signal input. When the pin is low, initialization of the chip is executed.
15 D/C# Data/Command Control
This pin is Data/Command control pin. When the pin is pulled high, the input at D7~D0 is treated as display data.
When the pin is pulled low, the input at D7~D0 will be transferred to the command register. For detail relationship to MCU interface signals, please refer to the Timing Characteristics Diagrams.
When the pin is pulled high and serial interface mode is selected, the data at SDIN is treated as data. When it is pulled low, the data at SDIN will be transferred to the command register. In I2C mode, this pin acts as SA0 for slave address selection.
16 R/W# Read/Write Select or Write
This pin is MCU interface input. When interfacing to a 68XX-series microprocessor, this pin will be used as Read/Write (R/W#) selection input. Pull this pin to “High” for read mode and pull it to “Low” for write mode.
When 80XX interface mode is selected, this pin will be the Write (WR#) input. Data write operation is initiated when this pin is pulled low and the CS# is pulled low.
17 E/RD# Read/Write Enable or Read
This pin is MCU interface input. When interfacing to a 68XX-series microprocessor, this pin will be used as the Enable (E) signal. Read/write operation is initiated when this pin is pulled high and the CS# is pulled low.
When connecting to an 80XX-microprocessor, this pin receives the Read (RD#) signal. Data read operation is initiated when this pin is pulled low and CS# is pulled low.
18~25 D0~D7 Host Data Input/Output Bus
These pins are 8-bit bi-directional data bus to be connected to the microprocessor’s data bus. When serial mode is selected, D1 will be the serial data input SDIN and D0 will be the serial clock input SCLK. When I2C mode is selected, D2 & D1 should be tired together and serve as SDAout & SDAin in application and D0 is the serial clock input SCL.
26 IREF Current Reference for Brightness Adjustment
This pin is segment current reference pin. A resistor should be connected between this pin and VSS. Set the current lower than 12.5μA.
27 VCOMH Voltage Output High Level for COM Signal
This pin is the input pin for the voltage output high level for COM signals. A capacitor should be connected between this pin and VSS.
28 VCC Power Supply for OEL Panel
This is the most positive voltage supply pin of the chip. A stabilization capacitor should be connected between this pin and VSS when the converter is used. It must be connected to external source when the converter is not used.
29 VLSS Ground of Analog Circuit
This is an analog ground pin. It should be connected to VSS externally.
30 NC
(GND)
Reserved Pin (Supporting Pin)
The supporting pins can reduce the influences from stresses on the function pins. These pins must be connected to external ground.

Mechanical Data

Item WEO012864D-ZIF
Thinner version without Sponge
WEO012864D-ZIF
Thinner version with sponge
Unit
Dot Matrix 128 × 64 128 × 64 Dots
Module dimension 26.70 × 19.26 × 1.26 26.70 × 19.26 × 1.61 mm
Active Area 21.738 × 10.858 21.738 × 10.858 mm
Pixel Size 0.148 × 0.148 0.148 × 0.148 mm
Pixel Pitch 0.17 × 0.17 0.17 × 0.17 mm
Display Mode Passive Matrix Passive Matrix  
Display Color WEO012864DWPP3N00F00 (White)
WEO012864DBPP3N00F00 (Yellow)
WEO012864DWPP3N00F01 (White)
WEO012864DBPP3N00F01 (Yellow)
 
Drive Duty 1/64 Duty 1/64 Duty  
IC SSD1306BZ SSD1306BZ  
Interface 6800,8080,SPI,I2C 6800,8080,SPI,I2C  
Size 0.96 inch 0.96 inch  

Electronical Characteristics

Item Symbol Condition Min Typ Max Unit
Supply Voltage for Logic VDD 2.8 3.0 3.3 V
Supply Voltage for Display VCC 11.5 12.0 12.5 V
Input High Volt. VIH 0.8×VDD VDDIO V
Input Low Volt. VIL 0 0.2×VDD V
Output High Volt. VOH 0.9×VDD VDDIO V
Output Low Volt. VOL 0 0.1×VDD V
Operating Current for VCC (50% display ON)   ICC 19.5 25.0 mA

Absolute Maximum Ratings

Parameter Symbol Min Max Unit
Supply Voltage for Logic VDD 0 4.0 V
Supply Voltage for Display VCC 0 15.0 V
Operating Temperature TOP -40 +80 °C
Storage Temperature TSTG -40 +85 °C

 

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